WID-300
E&R WID Si wafer marking
E&R WID Glass wafer marking
Marking Performance |
|
Marking Modes |
Softmark (Dark Mark), Hardmark (White Mark), Dot Matrix |
Fonts |
Dot Matrix (SEMI 5x9, 10x18, 15x23, and 9x17) Barcode (SEMI 412, IBM 412) 2D Code (SEMI T7) |
Dot Size |
25 ~ 80um (depending on material & process) |
Dot Depth |
0.1 – 3 μm (Si) |
Repeatability |
± 100um |
WPH |
~150 |
Handling System |
|
Wafer Size |
8",12" |
Robot |
Double Arm Robot |
Wafer handling |
Vacuum |
Load Port |
FOUP x 2 |
Alignment |
Optical alignment for both flatted and notched wafers |
Workstation |
|
Operator System |
Win7 |
GUI |
English / Chinese |
Communication |
SECS II / GEM Interface optional |