Glass cutting
E&R’s laser glass technology application in cutting system can carry out the free-form cutting with high quality at high speed. Laser cutting process is applicable to various glass materials, which is up to 2.0mm thickness(thicker is available under demand).
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Sidewall roughness,
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Wet etching assisted is available, if minimal feature size and defect-free is required
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Chipping : <20μm
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No debris on back and front surface
Dicing-frame compatible process
Separation methods :
•Thermal
laser separation
•Mechanical
separation
•Etching
Separation
