E&R’s laser glass technology application in cutting system can carry out the free-form cutting with high quality at high speed. Laser cutting process is applicable to various glass materials, which is up to 2.0mm thickness(thicker is available under demand).
Wet etching assisted is available, if minimal feature size and defect-free is required
Chipping : <20μm
No debris on back and front surface
Dicing-frame compatible process
Separation methods :