Glass cutting​

E&R’s laser glass technology application in cutting system can carry out the free-form cutting with high quality at high speed. Laser cutting process is applicable to various glass materials, which is up to 2.0mm thickness(thicker is available under demand).

  • Sidewall roughness,

  • Wet etching assisted is available, if minimal feature size and defect-free is required

  • Chipping  : <20μm

  • No debris on back and front surface


Dicing-frame compatible process

Separation methods :

•Thermal laser separation
•Mechanical separation
•Etching Separation