TGV workshop​

TGV workshop

E&R has been dedicated to develop glass micro-machining techniques employed in the MEMS, display and WLO(Wafer Level Optics) devices. This patented technology is applicable to fabricate various geometric shapes.

  • Through Glass Via, TGV, is usually employed as the glass interposer, 3D sensing or WLO devices

  • Glass cavity, cap or spacer, to form the hermetic seal, is usually employed for MEMS or WLO packaging

  • Glass frame/mesh

  • Free-form, according to customer’s requirement

  • Free from machining defects, e.g. crack and chipping

  • Feature scale as small as 15um

  • Wafer process, compatible with existed facilities

  • Fast throughput

  • Cost effective solution, in terms of material cost and initial investment


E&R is happy to provide process development and small-scale production services. 

  • Our processes can be easily customized for a variety of glasses and extended to the other materials, e.g. quartz and sapphire.


TGV

Material
Borosilicate/Quartz
Wafer size
Φ8”
Thickness
50 - 400μm
Via diameter
Φ15 μm, minimum
Diameter variation
±5%
Aspect ratio
10 : 1, maximum



Glass cavity / cap

service02.jpg

Material
Borosilicate
Wafer size
Φ8”
Thickness
50 - 400μm
Cavity dimension
φ0.2mm/□0.2mm, minimum
Cavity shape
customization
Chipping
≦10um



Glass frame / spacer

service03.jpgservice04.jpg

Material
Borosilicate
Wafer size
Φ8”
Thickness
100 - 400μm
Dimension
Φ0.3mm/□0.3mm, minimum
Shape
customization
Chipping
≦30um
Corner radius
≧30um