TGV workshop​

TGV workshop

E&R has been dedicated to develop glass micro-machining techniques employed in the MEMS, display and WLO(Wafer Level Optics) devices. This patented technology is applicable to fabricate various geometric shapes.

  • Through Glass Via, TGV, is usually employed as the glass interposer, 3D sensing or WLO devices

  • Glass cavity, cap or spacer, to form the hermetic seal, is usually employed for MEMS or WLO packaging

  • Glass frame/mesh

  • Free-form, according to customer’s requirement

  • Free from machining defects, e.g. crack and chipping

  • Feature scale as small as 15um

  • Wafer process, compatible with existed facilities

  • Fast throughput

  • Cost effective solution, in terms of material cost and initial investment


E&R is happy to provide process development and small-scale production services. 

  • Our processes can be easily customized for a variety of glasses and extended to the other materials, e.g. quartz and sapphire.


TGV :

service01.jpg

Material

Borosilicate/Quartz

Wafer size

Φ8”

Thickness

50 - 400μm

Via diameter

Φ15 μm, minimum

Diameter variation

±5%

Aspect ratio

10 : 1, maximum


Glass cavity / cap :

service02.jpg

Material

Borosilicate

Wafer size

Φ8”

Thickness

50 - 400μm

Cavity dimension

φ0.2mm/□0.2mm, minimum

Cavity shape

customization

Chipping

≦10um


Glass frame / spacer :

service03.jpgservice04.jpg

Material

Borosilicate

Wafer size

Φ8”

Thickness

100 - 400μm

Dimension

Φ0.3mm/□0.3mm, minimum

Shape

customization

Chipping

≦30um

Corner radius

≧30um