GC-200
實現近乎無崩邊、側壁平順及低(或無)殘留的加工。
為全自動設備，最大工作範圍為8吋晶圓：
滿足現在及未來的生產需求。
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Workpiece |
Diameter |
8” wafer |
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Thickness |
<2.5mm |
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Carrier |
Wafer mounted on the dicing frame |
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Laser & Optics |
Type |
Pico-econd laser |
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Power |
<50W or <150W |
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Repetition rate |
<600kHz |
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In-situ power monitor |
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Moving stage |
Working area |
210x210mm max. |
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Speed |
1000mm/sec, max. |
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Resolution |
0.1um |
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Position accuracy |
<3um for cutting <5um for drilling |
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Z-axis |
Stroke |
+/- 3 mm |
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Repeatability |
1um, single direction |
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θ-axis |
Stroke |
<190° |
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Repeatability |
<2 arc-sec |
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Vision |
Quantity |
High & low magnification |
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Resolution |
0.56um for high magnification |
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Mechanical breaking (Optional) |
Air blow |
2~4kg/cm2 |
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Roller ejection amount |
0~10mm |
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Upthrust amount |
0~20mm |
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Via drilling (Optional software) |
Data input |
DXF |
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Raster mode available |
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V-cut optics (Optional) |
Single or multi foci switchable |
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Working distance |
1mm |
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