GC-200
實現近乎無崩邊、側壁平順及低(或無)殘留的加工。
為全自動設備,最大工作範圍為8吋晶圓:
滿足現在及未來的生產需求。
Workpiece |
Diameter |
8” wafer |
Thickness |
<2.5mm |
|
Carrier |
Wafer mounted on the dicing frame |
|
Laser & Optics |
Type |
Pico-econd laser |
Power |
<50W or <150W |
|
Repetition rate |
<600kHz |
|
In-situ power monitor |
||
Moving stage |
Working area |
210x210mm max. |
Speed |
1000mm/sec, max. |
|
Resolution |
0.1um |
|
Position accuracy |
<3um for cutting <5um for drilling |
|
Z-axis |
Stroke |
+/- 3 mm |
Repeatability |
1um, single direction |
|
θ-axis |
Stroke |
<190° |
Repeatability |
<2 arc-sec |
|
Vision |
Quantity |
High & low magnification |
Resolution |
0.56um for high magnification |
|
Mechanical breaking (Optional) |
Air blow |
2~4kg/cm2 |
Roller ejection amount |
0~10mm |
|
Upthrust amount |
0~20mm |
|
Via drilling (Optional software) |
Data input |
DXF |
Raster mode available |
||
V-cut optics (Optional) |
Single or multi foci switchable |
|
Working distance |
1mm |