Fan-out wafer drilling/pattering​

For fan-out process, stacked molded IC, Package-On-Package(POP) assembly, can increase the functionalities and reduce the form factor. Laser machining is an effective way either to drill the Through Mold Via(TMV) or reveal the buried bumps from the bulk EMC substrate.

E&R’s laser system can fulfill both fabrications precisely, thanks to its precise alignment algorithm. 


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