Chip stress relief
Grinding marks on the wafer backside propagating into the buck silicon material will weaken the chip strength. Dicing crack on the edges of the chip propagating into the active area will induce the early failure of this chip.
E&R’s plasma system can remove the grinding marks and dicing cracks to maintain the high production yield. Thanks to dry etching at the low temperature, either back-grinding tape or dicing tape can be kept intact during processing.
Grinding mark left on the wafer backside, Before plasma stress relief
Grinding mark removed from the wafer backside, Before plasma stress relief