• WB AG Series

WB AG Series

提供6吋,8吋,12吋FFC ​或是Bare Type晶圓上進行雷射打印自動化設備。​

01 Load/Unload

6", 8",12" Adapt  

Dual Arm, both FFC, Bare wafer available


02 Laser System

Green Laser

Available for single, TWIN green laser


03 New Design

Aligner & Chuck Table 

Top side clamper & Bottom vacuum cover high warpage wafers


04 CIM Automation

Wafer ID Reader

OCR reader and SECS/GEN function, auto download recipe


05 Quality Check

In-Line QC

5M Top & Bottom side CCD check quality and Shift


06 Capability

Applications

Bare Si grinded/non-grinded, Compound. Metal/Polyimide coated, BSP 2in 1…Softmark (Dark mark) or Hardmark (White mark)



E&R WB-300AG Wafer Back side marking machine

Marking Performance

Marking Modes

Softmark (Dark Mark), Hardmark (White Mark), Dot Matrix

Fonts

SEMI OCR, Dot Matrix and Customized designs

Mini. Character Height

250um (Option for smaller character)

Accuracy

± 50um

Repeatability

± 25um

UPH

500 CPS

Marking Capability

Background, Polished, Coated, Oxidized, Nickel, Through Tape

Depth of Marking

White marking < 3 um, Dark marking < 0.1um, Film marking < 10um

Wafer Handling

Wafer Size

8",12“ -> WB-300AG

6”, 8”  -> WB-200AG

Wafer Thickness

150um (Warpage<6mm)* 

(Options to <8mm solution available)

Load Port

Foup x 2 + FFC Cassette x 1

Alignment

Optical alignment for both flatted and notched wafers

X-Y Table Accuracy

± 5um

Workstation

Operator System

English / Chinese

Communication

SECS II / GEM Interface optional

BSP Wafer Solution

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2in1 BSP wafer marking w/o bubble with 45um spot size


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2in1 BSP wafer marking imagine under E&R In-line QC

Si White Marking

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Si White Marking

Competitor Fiber Green Laser

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E&R End-Pump Green Laser

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Si Dark Marking

Line Width: 50.6/48.1um
Depth: < 0.1um






Through Tape Marking

LC86R40CD

BSL

IR BSL

2in1


D821HS

UC-3157T

UC-3157T + LC