WB AG Series

提供6吋,8吋,12吋FFC 或是Bare Type晶圓上進行雷射打印自動化設備。

數量 :

01 Load/Unload

Dual Arm, both FFC, Bare wafer available

02 Laser System

Available for single, TWIN green laser

03 New Design

Top side clamper & Bottom vacuum cover high warpage wafers

04 CIM Automation

OCR reader and SECS/GEN function, auto download recipe

05 Quality Check

5M Top & Bottom side CCD check quality and Shift

06 Capability

Bare Si grinded/non-grinded, Compound. Metal/Polyimide coated, BSP 2in 1…Softmark (Dark mark) or Hardmark (White mark)

E&R WB-300AG Wafer Back side marking machine

Marking Performance
Marking Modes	Softmark (Dark Mark), Hardmark (White Mark), Dot Matrix
Fonts	SEMI OCR, Dot Matrix and Customized designs
Mini. Character Height	250um (Option for smaller character)
Accuracy	± 50um
Repeatability	± 25um
UPH	≧500 CPS
Marking Capability	Background, Polished, Coated, Oxidized, Nickel, Through Tape
Depth of Marking	White marking < 3 um, Dark marking < 0.1um, Film marking < 10um
Wafer Handling
Wafer Size	8",12“ -> WB-300AG 6”, 8” -> WB-200AG
Wafer Thickness	≧150um (Warpage<6mm)* (Options to <8mm solution available)
Load Port	Foup x 2 + FFC Cassette x 1
Alignment	Optical alignment for both flatted and notched wafers
X-Y Table Accuracy	± 5um
Workstation
Operator System	English / Chinese
Communication	SECS II / GEM Interface optional