WB AG Series
01 Load/Unload
6", 8",12" Adapt
Dual Arm, both FFC, Bare wafer available
02 Laser System
Green Laser
Available for single, TWIN green laser
03 New Design
Aligner & Chuck Table
Top side clamper & Bottom vacuum cover high warpage wafers
04 CIM Automation
Wafer ID Reader
OCR reader and SECS/GEN function, auto download recipe
05 Quality Check
In-Line QC
5M Top & Bottom side CCD check quality and Shift
06 Capability
Applications
Bare Si grinded/non-grinded, Compound. Metal/Polyimide coated, BSP 2in 1…Softmark (Dark mark) or Hardmark (White mark)
E&R WB-300AG Wafer Back side marking machine
|
Marking Performance |
|
|
Marking Modes |
Softmark (Dark Mark), Hardmark (White Mark), Dot Matrix |
|
Fonts |
SEMI OCR, Dot Matrix and Customized designs |
|
Mini. Character Height |
250um (Option for smaller character) |
|
Accuracy |
± 50um |
|
Repeatability |
± 25um |
|
UPH |
≧500 CPS |
|
Marking Capability |
Background, Polished, Coated, Oxidized, Nickel, Through Tape |
|
Depth of Marking |
White marking < 3 um, Dark marking < 0.1um, Film marking < 10um |
|
Wafer Handling |
|
|
Wafer Size |
8",12“ -> WB-300AG 6”, 8” -> WB-200AG |
|
Wafer Thickness |
≧150um (Warpage<6mm)* (Options to <8mm solution available) |
|
Load Port |
Foup x 2 + FFC Cassette x 1 |
|
Alignment |
Optical alignment for both flatted and notched wafers |
|
X-Y Table Accuracy |
± 5um |
|
Workstation |
|
|
Operator System |
English / Chinese |
|
Communication |
SECS II / GEM Interface optional |
BSP Wafer Solution
2in1 BSP wafer marking w/o bubble with 45um spot size
2in1 BSP wafer marking imagine under E&R In-line QC
Si White Marking
Si White Marking
Competitor Fiber Green Laser
E&R End-Pump Green Laser
Si Dark Marking
Line Width: 50.6/48.1um
Depth: < 0.1um
Through Tape Marking
LC86R40CD
BSL
IR BSL
2in1
D821HS
UC-3157T
UC-3157T + LC
