Thin wafer dicing​

Dicing the thin wafer, below 100um thickness, is always challenging to the diamond blade. The associated defects, Include chipping, crack, peeling, metal burr and so on. Thanks to the non-contact machining, laser dicing can get the uncompromised quality at the high feed rate. When the wafer gets thinner and thinner, cutting speed of laser is faster and faster.

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Top view, kerf

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Backside

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Sidewall, X-direction

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Sidewall, Y-direction


Thanks to the unique laser & optic technologies, E&R’s laser system can cut a variety of material layers, i.e. copper, aluminum, low-k, silicon oxide, silicon nitride and silicon, through the simple set-up of recipe which enhances the production yield. Compared to the solution of Dicing Before Grinding(DBG), laser dicing is an cost effective solution.