Copper oxide removal​

Copper is apt to be oxidized during the IC assembly process. Higher oxide content will increase the electrical resistance and is detrimental to reliability of IC.

E&R’s plasma system can completely reduce the copper oxide at the low temperature in order to prevent the unwanted warpage of the adjacent polymer sheet, e.g. embedded FPCB sheet, 600x600mm.

technology07.jpg

Embedded FPCB sheet, 600x600mm

Copper oxidized,

Before plasma treatment     


Copper reduced,

After plasma treatment



technology08.jpg

Copper oxidized, lead-frame, Before plasma treatment

technology09.jpg

Copper reduced, lead-frame, After plasma treatment