鈦昇科技未來產品展望與核心技術藍圖
Wide Range Equipment to design for best Semicon Processes
更廣且更強大的設備應用，更好的半導體製程選擇
In the coming future, E&R not only keep our key technology and experience in substrate level equipment, but also develop into Wafer Level equipment, providing wafer level laser, plasma solution to semiconductor market.
In 2020, E&R wish to enter more different industries and offer more possibility, make the life easier, fulfill more demands and dreams!
鈦昇科技不僅維持我們在Substrate Level 設備的專業技術能力和經驗，同時也朝向晶圓等級的產品持續努力不懈的研發，提供市場不同的選擇。
在2020年，E&R 期許自己不只限於半討體領域，更能跨足到不同產業，提供更多不同的可能，讓生活更簡單，滿足更多不同的需求!
Strategy in Wafer Laser Applications
晶圓等級的設備應用策略
Back Side Scribing without Coating Material by using Femto Green
- Multiple Material in the same Cutting Street which Nano UV cannot perform
- New Material that Nano UV cannot perform but only Femto Green/UV like SiO2
- Hybrid Applications like Irregular Shape
- 6/8” Wafer Back Side Scribing solutions
