E&R Engineering Corp. will showcase Laser × Plasma technologies at SEMICON West 2026, addressing the evolving demands of high-speed optical communication, CPO, and advanced packaging.
2D FAU High-Precision Laser Processing
Designed for 2D FAU applications from 3.2T and 6.4T to 12.8T, E&R integrates five-axis laser control, precision positioning, and microfabrication technologies to achieve drilling accuracy of up to ±0.5 μm. The solution supports various hole geometries and processing angles, enabling high-precision fabrication for high-speed optical communication and CPO applications.

Featuring Hybrid MW–RF Plasma with independently controlled MW and RF power, E&R's plasma solutions support low-damage surface activation, cleaning, descum, de-smear, and deep silicon etching—delivering flexible and low-damage process capabilities for advanced semiconductor applications.

E&R Engineering Corp.
Advanced Laser & Plasma Innovation Provider

Advanced Plasma Technology

We warmly invite you to visit E&R Engineering Corp. at SEMICON West 2026 and discover our latest innovations in Laser Precision × Plasma Technology.

E&R Engineering Corp.
Advanced Laser & Plasma Innovation Provider