• WS-200

WS-200

4~8 inch wafer available


Wafer

Diameter

4”~8” wafer mounted on the dicing frame

Thickness

0.1~12mm

Warpage

0.5~5mm, before tape mounting

Carrier

12” dicing frame


Mechanism & vision system

X-axis

Function

To index the wafer pitch-by-pitch,
Driven by the linear motor with the linear scale

Stroke

210mm max.

Speed

1000mm/sec, max.

Resolution

0.1um

Position accuracy

<3um @ 5mm indexing
<5um within 200mm moving 

Straightness

<3um/200mm

Y-axis

Function

To feed the wafer beneath the laser beam,
Driven by the linear motor with the linear scale

Stroke

210mm max.

Speed

1000mm/sec, max.

Resolution

0.1um

Straightness

<3um/200mm

Z-axis

Function

Adjustment for the working distance of laser beam.
Driven by the bolt screw with the stepping motor

Stroke

±10mm

Repeatability

1um, single direction

Resolution

0.1um

θ-axis

Function

Work with the top CCD to define the wafer center and the first kerf position.
Change the scribing direction.
Driven by DD motor with the rotary encoder.
Software function can offset the error of 90 degree rotation by inputting an angular offset.

Stroke

<190°

Repeatability

<1 arc-sec