CRM-300
CRM-300 is a fully automatic, two-chamber, plasma processing system for the single-wafer applications.
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Applications
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Epoxy Molding Compound(EMC) thinning
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Residue removal of Epoxy Molding Compound(EMC) after molding, plasma deflash
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Residue removal of Epoxy Molding Compound(EMC) after laser drilling, plasma desmear
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Photoresist removal and descum in bumping process
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Sacrificial layer removal , i.e. Photoresist, polyimide, Silicon oxide, PMMA and so on.
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Wafer backside stress relief
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Through Silicon Via(TSV) exposing(active side attached on back-grinding tape)
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Features
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Microwave plasma source, providing isotroptic etching.
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Temperature controllable chuck is optional available, ranging from RT to 250 °C.
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Cooling chuck is optional available to prevent the back-grinding tape from damage.
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Spin processor is optional available for post-cleaning.
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System can be configured for 8” or 12” wafers using open cassette as well as FOUP or SMIF load-ports.
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Hydrogen generator is optionally available as a point-of-use gas supply.
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Automation, SECS/GEM, is available as an option.