CL-1000
CL-1000 is a fully automatic plasma processing system for frame-form applications. Workpiece, e.g. diced wafer, BGA/CSP substrate, QFN lead-frame, mounted on the dicing fame can be processed by this system.
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Applications
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Surface cleaning and activation prior to epoxy molding
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Anti-tackiness treatment
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Epoxy Molding Compound(EMC) thinning
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Residue removal of Epoxy Molding Compound(EMC) after molding, plasma deflash
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Residue removal of Epoxy Molding Compound(EMC) after laser drilling, plasma desmear
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Chip sidewall etching to enhance the die strength
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Through Silicon Via(TSV) exposing(active side attached on dicing tape)
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Features
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Microwave plasma source, providing isotroptic etching.
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Cooling chuck is optional available to prevent the dicing tape from damage.
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Rotating chuck enhances the uniform process.
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System can be configured for 8” or 12” dicing frame.
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Automation, SECS/GEM, is available as an option.