Singulation System

  • Substrate Saw APASS-502/503
    Substrate Saw system design to use in the semiconductor seal system regulative production,including Substrate and CSP,provided very fine that cuts the precision and high speed to Place & Pick production,The production and the new product research and development good ideal choice.
  • Package Saw APASS-602
    Package Saw system design to use in the semiconductor seal system regulative production,including BGA Substrate and QFN,provided very fine that cuts the precision and high speed to Place & Pick production,applies the CCD vision quality examination and the thorough elimination product surface dust,is each big PCB factory new product research and development good ideal choice。
  • Fine Laser Cutting System﹕μSD Cutting LaSAW-9931
    The E&R Micro SD Laser Cutting Machine is applied a Single Mode to cut all kinds of SD Card from strip to units.