Plasma

  • Microwave Plasma Cleaner
  • Wafer Plasma Cleaner
    Wafer Plasma Cleaner
  • In Line Plasmax-602A
    The Plasma is specially designed for uniform plasma cleaning of two lanes on BGA or lead-frame before wire-bonding or molding. The system consists of three units, loader and un-loader on both side and plasma chamber in center part respectively. The reactor chamber is of parallel plate design to perform uniform plasma clean on the three lanes.
  • In Line Plasmax-604A
    The Plasma is specially designed for uniform plasma cleaning of four lanes on BGA or lead-frame before wire-bonding or molding. The system consists of three units, loader and un-loader on both side and plasma chamber in center part respectively. The reactor chamber is of parallel plate design to perform uniform plasma clean on the three lanes.
  • Automatic Strip Loading Plasma
    Application: SMT Flux clean GPP substrate clean, Fine-pitch BGA substrate clean, Modify Substrate, L/F, On Boat Flipchip surface for Improving Adhesion
  • Chamber Plasma (Magazine Loading)
    Application: E&R cooperates with NCKU, Tailor-made for IC/LED/LD assembly Industry, Employed for improving, Wire bonding ,Molding,(Die attached),(Ball attached),(Making)
  • Plasmax-600 Series
    The Plasma is specially designed for uniform plasma cleaning of four lanes on BGA or lead-frame before wire-bonding or molding. The reactor chamber is of parallel plate design to perform uniform plasma clean on the three lanes.
  • Plasmax-800/900 Series
    The Plasma is specially designed for cleaning application as before wire-bonding BGA with low frequency plasma source assists to generate higher Ion energy condition to make more effective process performance. The concept of “Compact” system was developed to be used for LED or IC industries.