Laser Application

  • Package Laser Cutting
    Package Laser Cutting
  • Wafer Backside Marking

    The E&R Blazon WB-300AG is designed for automatic wafer backside die marking with capability of processing 8” and 12” wafer.

    A specific 532nm green laser is used to perform softmark (dark mark) or hardmark (white mark) on a variety of wafer materials (Metal /Polyimide coated, bare Si grinded/non-grinded ) as well as through-tape wafer marking application.

  • Laser Glass Cutting System

    Laser Glass Cutting System(雷射玻璃切割機)

  • Laser Ceramic Drilling System

    Laser Ceramic Drilling System(雷射陶瓷鑽孔機)

  • LM-101A
    E&R’s laser marker is designed and focused on the application of top side and back side marking of lead frame and substrate with applied by most of famous semiconductor assembly and testing house.
  • B-2000T_CMBMC
    B-2000T_CMBMC
  • Tpatt-101p

    Tpatt-101p

  • Blazon-2000-CBC
    Application:IC Laser Marking IC Strip, Slot Magazine to Slot Magazine for ,PBGA . Mini BAG . Map BGA
  • BLAZON -2000-MBM
    Application:IC Laser Marking IC Strip, Stack Magazine to Stack Magazine for ,TSOP .TSSOP.QFP.TQFP.PLCC.SOP.SSOP
  • BLAZON -3000-CBC (Boat to Boat)
    Application:IC Laser Marking IC On Boat , Slot Magazine to Slot Magazine for FCBGA Laser Marking
  • LONTIS-2800
    Application:IC Laser Marking Tray to Tray TSOP,QFP,TQFP,BGA.,IC Unit Laser Marking.
  • B-2000-ED (Strip to Strip)
    E&R’s laser marker is designed and focused on the application of top side and back side marking of lead frame and substrate with applied by most of famous semiconductor assembly and testing house.
  • L-3000 (Tray to Tray)
    E&R’s laser marker is designed and focused on the application of top side and back side marking of lead frame and substrate with applied by most of famous semiconductor assembly and testing house.