Laser Application

Wafer Backside Marking

The E&R Blazon WB-300AG is designed for automatic wafer backside die marking with capability of processing 8” and 12” wafer.

A specific 532nm green laser is used to perform softmark (dark mark) or hardmark (white mark) on a variety of wafer materials (Metal /Polyimide coated, bare Si grinded/non-grinded ) as well as through-tape wafer marking application.

Wafer Backside Marking

產品介紹